Sustainable ceramic fabrication using cold sintering process

Ceramic materials are an integral part of modern technologies, with vast application fields ranging from building infrastructure to high performance aerospace and electronic devices. A central aspect in the fabrication of ceramic materials and components is the sintering step: a process under which dense and structurally sound solids are consolidated at high temperatures well above 1000C. While effective, such high temperatures pose major challenges: significant environmental impact due to high energy consumption, limited control over microstructure (grain growth), and undesirable reactions between different material phases. These issues hinder the development of advanced, multifunctional materials that rely on combining diverse materials, such as ceramic-metal-polymer composites. In this regard, the cold sintering process (CSP) emerges as a low temperature sintering technique, enabling the densification of ceramics at unprecedently low temperatures below 350 C. This is possible through the addition of a chemically active liquid phase and pressure application during sintering. Since its introduction in 2016, CSP has been successfully applied to a growing range of ceramics and composites. Nevertheless, research indicates that cold sintered ceramics may exhibit mechanical and electrical properties inferior to those sintered conventionally at high temperatures. These shortcomings are frequently linked to ultra-fine grain sizes stemming from the use of nanopowdersand to suboptimal grain boundary structures. Additionally, the behavior and properties of heterogeneous interfaces (e.g., metal/ceramic and polymer/ceramic) created via CSP remain poorly understood. Our project seeks to advance the fundamental understanding of microstructural evolution, grain boundary characteristics, and interfacial phenomena in cold sintered materials. Combining expertise in ceramic processing and mechanical characterization with the capabilities of international collaborators, the research will leverage cutting-edge tools such as atomic-resolution electron microscopy, non-destructive optical coherence tomography, and advanced electrical and structural characterization techniques. The outcome of this interdisciplinary and multiscale investigation will enrich the understanding of CSP and establish its potential as a viable alternative for high-performance applications. This groundwork will enable the development of energy-efficient and scalable manufacturing processes, opening the path for the fabrication of next-generation ceramic electronic devices and beyond.