Thermochemistry and Phase Equilibria in Ag-Cu-Ni-Sn
Thermochemistry and Phase Equilibria in Ag-Cu-Ni-Sn
Disciplines
Other Technical Sciences (20%); Chemistry (70%); Physics, Astronomy (10%)
Keywords
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Lead-Freee Solders,
Calorimetry,
Phase Diagram,
Thermochemistry,
Enthalpy Of Mixing,
Solid State Diffusion
The aim of this project is the experimental investigation and thermodynamic assessment of the quaternary system Ag-Cu-Ni-Sn including the binary and ternary sub-systems. This basic research work on intermetallic systems will also contribute to the COST-531 action. This COST action was succesfully initiated in order to generate and systematize information on thermochemistry, phase relations and physical properties of intermetallic systems relevant to lead-free solder materials. A lead-free solder database will be created which forms the basis for a systematic alloy design which is desired to avoid complex and time consuming trial and error methods. Lead and lead containing chemicals are among the top chemicals posing a considerable threat to human life and environment. Examples for new lead-free solders are Ag-Sn, Cu-Sn and Ag-Cu-Sn alloys with Sn as the main component (> 90 mass%). Other alloying components in discussion are Bi, In, Sb and Zn. The metals Ag, Cu, Au, Ni and Pd are commonly used as contact materials for solder joints. Thus binary, ternary and higher order intermetallic systems of the elements mentioned above are relevant for lead-free solders. Most of the binary systems are rather well investigated whereas uncomplete literature data are available for the ternary and higher order systems. For this project the investigation of interactions of the intermetallic solder system Ag-Cu-Sn with nickel as the contact material is planned. This includes measurements of thermochemical data in the solid as well as in the liquid state using calorimetry and e.m.f.-methods and the evaluation of phase relations by thermal analysis, XRD and metallography (EPMA). Furthermore diffusion experiments with Ag(Cu)-Sn alloys and Ni will be done. Thermodynamic calculations and assessments of the quaternary system Ag-Cu-Ni-Sn and its ternary sub-systems will provide all relevant phase diagram information in aggreement with experimental results. This work is also planned to gain deeper insight in relationships of phase equilibria, thermochemical properties and diffusion behaviour. Furthermore theoretical aspects of diffusion (Kirkendall effect) and enthalpy of mixing in the liquid state (pseudo-potential calculations and Fermi enthalpy) will be investigated.
The aim of this project is the experimental investigation and thermodynamic assessment of the quaternary system Ag-Cu-Ni-Sn including the binary and ternary sub-systems. This basic research work on intermetallic systems will also contribute to the COST-531 action. This COST action was succesfully initiated in order to generate and systematize information on thermochemistry, phase relations and physical properties of intermetallic systems relevant to lead-free solder materials. A lead-free solder database will be created which forms the basis for a systematic alloy design which is desired to avoid complex and time consuming trial and error methods. Lead and lead containing chemicals are among the top chemicals posing a considerable threat to human life and environment. Examples for new lead-free solders are Ag-Sn, Cu-Sn and Ag-Cu-Sn alloys with Sn as the main component (> 90 mass%). Other alloying components in discussion are Bi, In, Sb and Zn. The metals Ag, Cu, Au, Ni and Pd are commonly used as contact materials for solder joints. Thus binary, ternary and higher order intermetallic systems of the elements mentioned above are relevant for lead-free solders. Most of the binary systems are rather well investigated whereas uncomplete literature data are available for the ternary and higher order systems. For this project the investigation of interactions of the intermetallic solder system Ag-Cu-Sn with nickel as the contact material is planned. This includes measurements of thermochemical data in the solid as well as in the liquid state using calorimetry and e.m.f.-methods and the evaluation of phase relations by thermal analysis, XRD and metallography (EPMA). Furthermore diffusion experiments with Ag(Cu)-Sn alloys and Ni will be done. Thermodynamic calculations and assessments of the quaternary system Ag-Cu-Ni-Sn and its ternary sub-systems will provide all relevant phase diagram information in aggreement with experimental results. This work is also planned to gain deeper insight in relationships of phase equilibria, thermochemical properties and diffusion behaviour. Furthermore theoretical aspects of diffusion (Kirkendall effect) and enthalpy of mixing in the liquid state (pseudo-potential calculations and Fermi enthalpy) will be investigated.
- Universität Wien - 100%
- Ferdinand Sommer, Max-Planck-Institut für Metallforschung - Germany
- Alexander A. Kodentsov, Technische Universiteit Eindhoven - Netherlands
- Ursula Kattner, National Institute of Standards and Technology - USA
Research Output
- 541 Citations
- 12 Publications
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2011
Title Reliability of complete gravitational waveform models for compact binary coalescences DOI 10.1103/physrevd.84.064029 Type Journal Article Author Ohme F Journal Physical Review D Pages 064029 Link Publication -
2007
Title Phase Equilibria in the Ag-Ni-Sn System: Isothermal Sections DOI 10.1007/s11664-007-0205-6 Type Journal Article Author Schmetterer C Journal Journal of Electronic Materials Pages 1415-1428 Link Publication -
2007
Title Lead-free solders: Enthalpies of mixing of liquid Ag–Cu–Ni–Sn alloys DOI 10.1557/jmr.2007.0401 Type Journal Article Author Saeed U Journal Journal of Materials Research Pages 3218-3225 -
2007
Title A new investigation of the system Ni–Sn DOI 10.1016/j.intermet.2006.10.045 Type Journal Article Author Schmetterer C Journal Intermetallics Pages 869-884 -
2007
Title Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds DOI 10.1016/j.tca.2007.04.004 Type Journal Article Author Flandorfer H Journal Thermochimica Acta Pages 34-39 -
2006
Title Thermodynamics and phase diagrams of lead-free solder materials DOI 10.1007/s10854-006-9009-3 Type Journal Article Author Ipser H Journal Journal of Materials Science: Materials in Electronics Pages 3-17 -
2008
Title Phase equilibria in the system Ag–Ni–Sn: Thermal behavior DOI 10.1016/j.actamat.2007.09.005 Type Journal Article Author Schmetterer C Journal Acta Materialia Pages 155-164 -
2008
Title Cu-Ni-Sn: A Key System for Lead-Free Soldering DOI 10.1007/s11664-008-0522-4 Type Journal Article Author Schmetterer C Journal Journal of Electronic Materials Pages 10 -
2008
Title Enthalpies of mixing of liquid Bi–Cu and Bi–Cu–Sn alloys relevant for lead-free soldering DOI 10.1016/j.tca.2008.02.023 Type Journal Article Author Flandorfer H Journal Thermochimica Acta Pages 1-10 -
2008
Title On the temperature dependence of the enthalpies of mixing in liquid binary (Ag, Cu, Ni)–Sn alloys DOI 10.1016/j.jnoncrysol.2007.12.009 Type Journal Article Author Flandorfer H Journal Journal of Non-Crystalline Solids Pages 2953-2972 -
2005
Title The In–Pd–Sn phase diagram (xPd=0.6): Isothermal sections DOI 10.1016/j.intermet.2005.03.003 Type Journal Article Author Luef C Journal Intermetallics Pages 1207-1213 -
2010
Title Enthalpies of mixing of liquid In–Sn and In–Sn–Zn alloys DOI 10.1016/j.tca.2010.02.008 Type Journal Article Author Rechchach M Journal Thermochimica Acta Pages 66-72