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Thermochemistry and Phase Equilibria in Ag-Cu-Ni-Sn

Thermochemistry and Phase Equilibria in Ag-Cu-Ni-Sn

Hans Flandorfer (ORCID: 0000-0002-9692-2119)
  • Grant DOI 10.55776/P16495
  • Funding program Principal Investigator Projects
  • Status ended
  • Start December 1, 2003
  • End November 30, 2007
  • Funding amount € 136,983
  • Project website

Disciplines

Other Technical Sciences (20%); Chemistry (70%); Physics, Astronomy (10%)

Keywords

    Lead-Freee Solders, Calorimetry, Phase Diagram, Thermochemistry, Enthalpy Of Mixing, Solid State Diffusion

Abstract Final report

The aim of this project is the experimental investigation and thermodynamic assessment of the quaternary system Ag-Cu-Ni-Sn including the binary and ternary sub-systems. This basic research work on intermetallic systems will also contribute to the COST-531 action. This COST action was succesfully initiated in order to generate and systematize information on thermochemistry, phase relations and physical properties of intermetallic systems relevant to lead-free solder materials. A lead-free solder database will be created which forms the basis for a systematic alloy design which is desired to avoid complex and time consuming trial and error methods. Lead and lead containing chemicals are among the top chemicals posing a considerable threat to human life and environment. Examples for new lead-free solders are Ag-Sn, Cu-Sn and Ag-Cu-Sn alloys with Sn as the main component (> 90 mass%). Other alloying components in discussion are Bi, In, Sb and Zn. The metals Ag, Cu, Au, Ni and Pd are commonly used as contact materials for solder joints. Thus binary, ternary and higher order intermetallic systems of the elements mentioned above are relevant for lead-free solders. Most of the binary systems are rather well investigated whereas uncomplete literature data are available for the ternary and higher order systems. For this project the investigation of interactions of the intermetallic solder system Ag-Cu-Sn with nickel as the contact material is planned. This includes measurements of thermochemical data in the solid as well as in the liquid state using calorimetry and e.m.f.-methods and the evaluation of phase relations by thermal analysis, XRD and metallography (EPMA). Furthermore diffusion experiments with Ag(Cu)-Sn alloys and Ni will be done. Thermodynamic calculations and assessments of the quaternary system Ag-Cu-Ni-Sn and its ternary sub-systems will provide all relevant phase diagram information in aggreement with experimental results. This work is also planned to gain deeper insight in relationships of phase equilibria, thermochemical properties and diffusion behaviour. Furthermore theoretical aspects of diffusion (Kirkendall effect) and enthalpy of mixing in the liquid state (pseudo-potential calculations and Fermi enthalpy) will be investigated.

The aim of this project is the experimental investigation and thermodynamic assessment of the quaternary system Ag-Cu-Ni-Sn including the binary and ternary sub-systems. This basic research work on intermetallic systems will also contribute to the COST-531 action. This COST action was succesfully initiated in order to generate and systematize information on thermochemistry, phase relations and physical properties of intermetallic systems relevant to lead-free solder materials. A lead-free solder database will be created which forms the basis for a systematic alloy design which is desired to avoid complex and time consuming trial and error methods. Lead and lead containing chemicals are among the top chemicals posing a considerable threat to human life and environment. Examples for new lead-free solders are Ag-Sn, Cu-Sn and Ag-Cu-Sn alloys with Sn as the main component (> 90 mass%). Other alloying components in discussion are Bi, In, Sb and Zn. The metals Ag, Cu, Au, Ni and Pd are commonly used as contact materials for solder joints. Thus binary, ternary and higher order intermetallic systems of the elements mentioned above are relevant for lead-free solders. Most of the binary systems are rather well investigated whereas uncomplete literature data are available for the ternary and higher order systems. For this project the investigation of interactions of the intermetallic solder system Ag-Cu-Sn with nickel as the contact material is planned. This includes measurements of thermochemical data in the solid as well as in the liquid state using calorimetry and e.m.f.-methods and the evaluation of phase relations by thermal analysis, XRD and metallography (EPMA). Furthermore diffusion experiments with Ag(Cu)-Sn alloys and Ni will be done. Thermodynamic calculations and assessments of the quaternary system Ag-Cu-Ni-Sn and its ternary sub-systems will provide all relevant phase diagram information in aggreement with experimental results. This work is also planned to gain deeper insight in relationships of phase equilibria, thermochemical properties and diffusion behaviour. Furthermore theoretical aspects of diffusion (Kirkendall effect) and enthalpy of mixing in the liquid state (pseudo-potential calculations and Fermi enthalpy) will be investigated.

Research institution(s)
  • Universität Wien - 100%
International project participants
  • Ferdinand Sommer, Max-Planck-Institut für Metallforschung - Germany
  • Alexander A. Kodentsov, Technische Universiteit Eindhoven - Netherlands
  • Ursula Kattner, National Institute of Standards and Technology - USA

Research Output

  • 541 Citations
  • 12 Publications
Publications
  • 2011
    Title Reliability of complete gravitational waveform models for compact binary coalescences
    DOI 10.1103/physrevd.84.064029
    Type Journal Article
    Author Ohme F
    Journal Physical Review D
    Pages 064029
    Link Publication
  • 2007
    Title Phase Equilibria in the Ag-Ni-Sn System: Isothermal Sections
    DOI 10.1007/s11664-007-0205-6
    Type Journal Article
    Author Schmetterer C
    Journal Journal of Electronic Materials
    Pages 1415-1428
    Link Publication
  • 2007
    Title Lead-free solders: Enthalpies of mixing of liquid Ag–Cu–Ni–Sn alloys
    DOI 10.1557/jmr.2007.0401
    Type Journal Article
    Author Saeed U
    Journal Journal of Materials Research
    Pages 3218-3225
  • 2007
    Title A new investigation of the system Ni–Sn
    DOI 10.1016/j.intermet.2006.10.045
    Type Journal Article
    Author Schmetterer C
    Journal Intermetallics
    Pages 869-884
  • 2007
    Title Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds
    DOI 10.1016/j.tca.2007.04.004
    Type Journal Article
    Author Flandorfer H
    Journal Thermochimica Acta
    Pages 34-39
  • 2006
    Title Thermodynamics and phase diagrams of lead-free solder materials
    DOI 10.1007/s10854-006-9009-3
    Type Journal Article
    Author Ipser H
    Journal Journal of Materials Science: Materials in Electronics
    Pages 3-17
  • 2008
    Title Phase equilibria in the system Ag–Ni–Sn: Thermal behavior
    DOI 10.1016/j.actamat.2007.09.005
    Type Journal Article
    Author Schmetterer C
    Journal Acta Materialia
    Pages 155-164
  • 2008
    Title Cu-Ni-Sn: A Key System for Lead-Free Soldering
    DOI 10.1007/s11664-008-0522-4
    Type Journal Article
    Author Schmetterer C
    Journal Journal of Electronic Materials
    Pages 10
  • 2008
    Title Enthalpies of mixing of liquid Bi–Cu and Bi–Cu–Sn alloys relevant for lead-free soldering
    DOI 10.1016/j.tca.2008.02.023
    Type Journal Article
    Author Flandorfer H
    Journal Thermochimica Acta
    Pages 1-10
  • 2008
    Title On the temperature dependence of the enthalpies of mixing in liquid binary (Ag, Cu, Ni)–Sn alloys
    DOI 10.1016/j.jnoncrysol.2007.12.009
    Type Journal Article
    Author Flandorfer H
    Journal Journal of Non-Crystalline Solids
    Pages 2953-2972
  • 2005
    Title The In–Pd–Sn phase diagram (xPd=0.6): Isothermal sections
    DOI 10.1016/j.intermet.2005.03.003
    Type Journal Article
    Author Luef C
    Journal Intermetallics
    Pages 1207-1213
  • 2010
    Title Enthalpies of mixing of liquid In–Sn and In–Sn–Zn alloys
    DOI 10.1016/j.tca.2010.02.008
    Type Journal Article
    Author Rechchach M
    Journal Thermochimica Acta
    Pages 66-72

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