The correlation between thermal and mechanical interface

The increase of power densities and therefore heat generation in electronic components, which leads to higher operation temperatures, requires high performance materials and components which meet these requirements. A main reason for this high temperatures is the thermal contact resistance between the contact surfaces of two component systems. A similar problem exists in Metal Matrix Composites (MMCs) where fibers are embedded in a metal matrix. Requirements to such materials are in many cases a well bonded mechanical interface between the matrix and the fiber combined with an optimised thermal interfaces. Therefore the main focus within the project will be the investigation of the correlation between the mechanical and the thermal interface in special two component systems. This requires on the one hand investigations of the thermal contact resistance (TCR) and on the other hand investigations of the mechanical interface properties in two component systems such as substrate-substrate systems, coating-substrate systems and fiber-matrix systems. Because of the fact that investigations of the thermal interface in such systems require expensive equipments, the Austrian Research Centers Seibersdorf found three competent cooperation partners, where special measurement techniques are available. Within the project a cooperation with these institutes is planned and the support of these institutes is given. The outcome of the project will be a detailed knowledge of the correlation between thermal and mechanical interfaces, which will be used to set-up a contactless method for the determination of thermal interface properties. By using the investigated correlation an indirect statement about the mechanical interface should be possible. This knowledge would be a very important step for using this technique in rapid quality control of electronic components. Additionally thermal microscopy and scanning thermal analysis will be used for the first time to investigate interfaces in metal matrix composites. A successful demonstration of the use of these techniques will be a very important step for future developments of interfaces in MMC-materials.